Description Capabilities
Layer Count1-30L (HDI:1+n+1; 2+n+2)
Board Thickness0.2mm- – -5.0mm
Copper WeightInner: 4oz, Outer: 6oz
MaterialFR4 (Kingboard,Shengyi,ILM,ITEQ,PTFE,OGERS,ARLON,ISOLA,TACONIC,Nelco)

Finish Size

Min: 10*10mm,  Max:1200*500mm

Surface TreatmentHASL, HASL Lead free, OSP,ENIG(1u”-8u”),HardGoldplatedupto50u”,
 Immersion silver, Immersion Tin, Carbon Ink
Min Space of Drilling Holes to Conductor0.15mm(<8L); 0.2mm(8L<14L);0.225mm(<=24L)
Min. Conductor Width/Space0.075/0.075mm(3/3mil)
Min Size of Solder PAD/AnnulusPad:0.4mm/0.3mm(Laser dill), Annulus:0.1mm
Profile Tolerance+/-0.15mm(Routing), +/-0.1mm(Punching)
Min Space from Conductor/Holes to Edge0.15mm/0.2mm
Warp & Twist0.3%-0.7%
Thickness of Peelablemask0.2-0.5mm (Max plugging holes: 4.5mm)
Bevel angle of gold finger20,30,45,60(Tolerance:+/-5degree)
Impedance toleranceSingle ended: 50-90ohms+/-5ohm ;Differential:100-155ohms+/-10%
Aspect Ratio<=10 :1