| Description | Capabilities |
|---|---|
| Layer Count | 1-30L (HDI:1+n+1; 2+n+2) |
| Board Thickness | 0.2mm- – -5.0mm |
| Copper Weight | Inner: 4oz, Outer: 6oz |
| Material | FR4 (Kingboard，Shengyi，ILM,ITEQ,PTFE,OGERS,ARLON,ISOLA,TACONIC,Nelco) |
Finish Size | Min: 10*10mm, Max:1200*500mm |
| Surface Treatment | HASL, HASL Lead free, OSP，ENIG(1u”-8u”),HardGoldplatedupto50u”, |
| Immersion silver, Immersion Tin, Carbon Ink | |
| Min Space of Drilling Holes to Conductor | 0.15mm(<8L); 0.2mm(8L<14L);0.225mm(<=24L) |
| Min. Conductor Width/Space | 0.075/0.075mm(3/3mil) |
| Min Size of Solder PAD/Annulus | Pad:0.4mm/0.3mm(Laser dill), Annulus:0.1mm |
| Profile Tolerance | +/-0.15mm(Routing), +/-0.1mm(Punching) |
| Min Space from Conductor/Holes to Edge | 0.15mm/0.2mm |
| Warp & Twist | 0.3%-0.7% |
| Thickness of Peelablemask | 0.2-0.5mm (Max plugging holes: 4.5mm) |
| Bevel angle of gold finger | 20，30，45，60(Tolerance:+/-5degree) |
| Impedance tolerance | Single ended: 50-90ohms+/-5ohm ;Differential:100-155ohms+/-10% |
| Aspect Ratio | <=10 ：1 |
Previous
Next
