About ENEPIG

ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold) process is a chemical plating method that first deposits a thin layer of nickel on the surface of the PCB, then a layer of palladium on top of it, and finally a layer of gold. This three-layer structure design not only provides good electrical performance, but also greatly enhances the corrosion resistance and wear resistance of the PCB.

Compared with traditional gold immersion processes, ENEPIG process has higher reliability. Although the gold layer has good conductivity and corrosion resistance, its hardness is low and it is prone to wear and tear. The addition of palladium layer effectively enhances the hardness of the PCB surface, making it more resistant to physical damage. Meanwhile, as the bottom layer, the nickel layer can effectively prevent copper atoms from diffusing into the gold layer, thereby avoiding the occurrence of the black nickel phenomenon.

Advantages:

• Excellent multiple reflow cycles
• Ensure good welding performance
• Highly reliable bonding capability
• Surface with a critical contact surface
• High compatibility with Sn Ag Cu solder
• Suitable for various packaging types, especially for PCBs with multiple packaging types
• No black nickel phenomenon

Disadvantages:

• Due to the excessive thickness of the palladium layer, the welding performance is reduced
• Slow wetting speed
• High cost