2024-10-31
LED packaging technology refers to the process of integrating light-emitting diode chips with other components into the packaging body. Different packaging technologies will directly affect the light type, color, and even product lifespan of LED products.
What are the types of LED packaging technologies?
DIP emerged in the late 1990s, which involves inserting LED chips directly into a PCB and then soldering them to create a display module. The process is relatively simple and the cost is relatively low, making it widely used in the early stages.
SMD is suitable for packaging P2-P10 with point-to-point spacing. It is also one of the most common packaging methods on the market. The LED chips are first packaged into light beads, and then the light beads are soldered onto the PCB to produce LED modules with different spacing. Each LED bead in SMD is an independent point light source. SMD emerged around 2002, with a relatively long development history, mature processes, good heat dissipation effects, and relatively low production costs.
COB involves directly attaching multiple bare LED chips onto a PCB, and then fully encapsulating the entire module. Without the need for brackets, the process is simpler, and a single packaging structure can contain a large number of pixels. Further reduced the spacing between points. Compared to SMD, COB has more obvious advantages, with no graininess in the display screen, softer and clearer images, and less visual fatigue.
COG is different from COB, COB fixes the chip on the PCB board, while COG directly fixes the LED chip on the TFT glass substrate (or TFT resin substrate) for overall packaging. COG has the characteristics of simple structure and high reliability, and is suitable for small-sized and ultra-thin display screens. Its advantage lies in saving space, improving product reliability and stability.
MCPCB is an LED package made on a metal substrate using printed circuit technology. MCPCB has the characteristics of good heat dissipation performance and high reliability, and is suitable for packaging high-power LEDs. MCPCB can also be designed and customized as needed to meet the needs of different application scenarios.
PLCC is a plastic packaging method with pins, which has the characteristics of small size and easy installation. PLCC is suitable for scenarios that require high-density installation, such as LED displays, indoor lighting, etc. PLCC can also achieve colorful effects and enhance visual effects through different color combinations.
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