2024-10-31
Stencil, also known as solder paste stencil, is one of the key components in the SMT production process. It is made of high-precision special stainless steel plate, and through precise laser cutting or electrochemical etching technology, specific hole patterns are created on the steel plate, which correspond to the positions of the components that need to be welded on the circuit board.
In the SMT production process, the main task of the stencil is to accurately print solder paste onto the positions of the components that need to be soldered on the PCB. This process is also known as solder paste printing.
In the process of solder paste printing, first place the solder paste on top of the stencil, and then use a scraper to evenly scrape the solder paste across the stencil, so that the solder paste can be accurately printed onto the PCB through the holes on the stencil. Then, the electronic components are precisely mounted onto the printed solder paste positions using a mounting machine, and finally soldered onto the PCB through reflow soldering.
Therefore, stencil plays a crucial role in SMT production. It not only ensures that the solder paste is accurately printed to the position that needs to be welded, but also controls the amount of solder paste by changing the size and shape of the holes on the steel mesh, thereby ensuring the welding quality.
The function of stencil
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