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Description Capabilities
1.Product Range 2-10L(HDI:1+N+1;2+N+2)
2.Board thickness 0.2mm-3.0mm
3.Copper Foil Inner: 3oz, Outer: 4oz
4.Board thickness’ tolerance +/-10%—–+/-8%
5.Material FR4+PI
6.Surface treatment HASL, HASL Lead free, OSP, Plating gold(1u”-50u”) ENIG(1u”-8u”) Gold Finger(1u”-50u”) Immersion silver,  Immersion Tin(0.8-1.5um)
7.Size of finished product Min: 10*10mm, Max: 1200*500mm
8.Min. mechanical via holes & pad Holes: 0.2mm/pad: 0.4mm
9.Min Laser drilling holes & pad 0.1mm, pad<0.1mm
10.Min. hole tolerance +/-0.05mm(NPTH), +/-0.075mm(PTH)
11.Min copper thickness of holes’wall 20um
12.Min space of drilling holes to conductor 0.15mm(<8L);0.2(8<14);0.225mm(<=24L)
13.Min. conductor width/space 0.075/0.075mm(3/3mil)
14.Min size of solder PAD/Annulus Pad:0.4mm/0.3mm(laser drilling),  Min.annual ring:0.1mm
15.Hole wall to conductor Innerlayers of multilayer 0.2mm
16.Hole to hole edge gap 0.8mm
17.Solder mask color & Thickness Color: Green, Black, Yellow, Blue, Red, White, Matt green Thickness: 10-20um
18.Silk-screen color White, Black, Yellow
19.Profile tolerance +/-0.15mm(Routing), +/-0.1mm(Punching)
20. Min space from conductor/holes to edge 0.15mm/0.2mm
21.Warp & twist 0.3%-0.7%
22.Thickness of peelablemask 0.2-0.5mm (Max plugging holes: 4.5mm)
23.Bevel angle of gold finger 20,30,45,60(Tolerance: +/-5 degree)
24.Impedance tolerance +/-5ohm
25.V-CUT board thickness 0.6-3.0mm
26. Max multi-press <=3
27.Min tolerance of milling slot +/-0.15mm
28.Ratio of board thickness/holes size 12:1